Semiconductor memory devices including a vertical channel transistor and methods of manufacturing the same

ABSTRACT

Semiconductor memory devices include a semiconductor substrate and a plurality of semiconductor material pillars in a spaced relationship on the semiconductor substrate. Respective surrounding gate electrodes surround ones of the pillars. A first source/drain region is in the semiconductor substrate between adjacent ones of the pillars and a second source/drain region is in an upper portion of at least one of the adjacent pillars. A buried bit line is in the first source/drain region and electrically coupled to the first source/drain region and a storage node electrode is on the upper portion of the at least one of the adjacent pillars and electrically contacting with the second source/drain region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is related to and claims priority from Korean PatentApplication No. 10-2004-0090496 filed on Nov. 8, 2004, the disclosure ofwhich is hereby incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to semiconductor devices, and moreparticularly, to semiconductor devices having a vertical channeltransistor and methods of manufacturing the same.

As the integration density of semiconductor (integrated circuit) devicesincreases, the size of metal-oxide-semiconductor (MOS) transistors, andthus, a channel length, of the devices generally decreases. The decreasein channel length generally enhances the integration density ofsemiconductor devices but may cause a short channel effect, such asdrain induced barrier lowering (DIBL), hot carrier effect, and/or punchthrough. To prevent such a short channel effect, various techniques havebeen suggested, such as a decrease of the depth of a junction region andan increase of a channel length by formation of groove in a channelregion.

However, as the integration density of semiconductor memory devices, inparticular, dynamic random access memory (DRAM) devices, currently maybe as high as a gigabit, smaller-sized MOS transistors are generallydesired. In particular, MOS transistors of gigabit DRAM devicesgenerally require a device area of 8F² (where “F” is a minimum featuresize of the device) or less. However, with currently available planarMOS transistors, in which junction regions are typically formed on bothsides of a gate electrode formed on a semiconductor substrate, it isgenerally difficult to obtain a device area of 8F² or less even when achannel length of the device is scaled.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide semiconductor memorydevices including a semiconductor substrate and a plurality ofsemiconductor material pillars in a spaced relationship on thesemiconductor substrate. Respective surrounding gate electrodes surroundones of the pillars. A first source/drain region is in the semiconductorsubstrate between adjacent ones of the pillars and a second source/drainregion is in an upper portion of at least one of the adjacent pillars. Aburied bit line is in the first source/drain region and electricallycoupled to the first source/drain region and a storage node electrode ison the upper portion of the at least one of the adjacent pillars andelectrically contacting with the second source/drain region.

In other embodiments of the present invention, semiconductor memorydevices include a semiconductor substrate including a plurality ofpillars separated from each other by a predetermined distance. A deviceisolation film is between the pillars. Respective surrounding gateelectrodes electrically insulated from the pillars surround an upperoutside of each pillar. First source/drain regions are formed in anupper portion of respective ones of the pillar and a second source/drainregion is formed in the semiconductor substrate between adjacent ones ofthe pillars. A buried bit line, interposed between the secondsource/drain region and the device isolation film, electrically contactsthe second source/drain region. A word line is formed in a cross-wisepattern with the bit line and electrically connected to ones of thesurrounding gate electrodes. Contact pads, formed on respective ones ofthe first source/drain regions, contact the respective ones of the firstsource/drain regions and storage node electrodes are formed on thecontact pads.

In yet other embodiments of the present invention, semiconductor memorydevices including a semiconductor substrate and a plurality ofsemiconductor material pillars in a spaced relationship on thesemiconductor substrate. A surrounding gate electrode surrounds an outersurface of ones of the pillars and a first source/drain region is in thesemiconductor substrate between adjacent ones of the pillars. A secondsource/drain region is in an upper portion of the ones of the pillars. Aburied bit line in the first source/drain region is electrically coupledto the first source/drain region and a storage node electrode on theupper portion of the ones of the pillars electrically contacts thesecond source/drain region.

In further embodiments of the present invention, semiconductor memorydevices include a word line contacting the surrounding gate electrodeand extending in a cross-wise pattern relative to the bit line. Aconductive spacer may be included between the surrounding gate electrodeand the word line. The conductive spacer may be on an upper outsidesurface of the surrounding gate electrode. A conductive film for theconductive spacer and the word line may include a transition metal filmof tungsten (W), cobalt (Co), nickel (Ni), and/or titanium (Ti); atransition metal silicide film of tungsten silicide (WSi_(x)), cobaltsilicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titaniumsilicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film(W).

In further embodiments of the present invention, the first and secondsource/drain regions are electrically insulated from the surroundinggate electrode. A dielectric material may be located between adjacentones of the pillars to electrically insulate the adjacent ones of thepillars. The bit line may be a transition metal silicide film.

In other embodiments of the present invention, the plurality of pillarsare formed in a matrix and are separated from each other by apredetermined distance. The first source/drain region is a drain regionof a vertical channel transistor and the second source/drain region is asource region of the vertical channel transistor.

In yet further embodiments of the present invention, semiconductormemory devices include a semiconductor substrate including a pluralityof pillars separated from each other by a predetermined distance with adevice isolation film between the pillars. A surrounding gate electrodeis electrically insulated from the pillars and surrounds an upperoutside of each pillar. A source region is formed in an upper portion ofeach pillar surrounded by the surrounding gate electrode. A drain regionis formed in the semiconductor substrate between the pillars. A buriedbit line, interposed between the drain region and the device isolationfilm, electrically contacts with the drain region. A word line is formedin a cross-wise pattern with the bit line and electrically connected tothe gate electrode. A contact pad, formed on the source region, contactswith the source region and a storage node electrode is formed on thecontact pad.

In other embodiments of the present invention, a conductive spacer ispositioned between an upper outside of the surrounding gate electrodeand the word line. A conductive film for the conductive spacer and theword line may be a material selected from a transition metal film formedof tungsten (W), cobalt (Co), nickel (Ni), and/or titanium (Ti); atransition metal silicide film formed of tungsten silicide (WSi_(x)),cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titaniumsilicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film(W). The bit line may surround a lower outside of each pillar. The bitline may be a transition metal silicide film.

In further embodiments of the present invention, methods ofmanufacturing a semiconductor memory device include forming a pluralityof semiconductor material pillars in a spaced relationship on asemiconductor substrate and forming respective surrounding gateelectrodes on ones of the pillars. A first source/drain region is formedin the semiconductor substrate between adjacent ones of the pillars. Abit line is formed in the first source/drain region and electricallycoupled to the first source/drain region. A second source/drain regionis formed in an upper portion of at least one of the adjacent ones ofthe pillars.

In yet other embodiments of the present invention, methods ofmanufacturing a semiconductor memory device include forming a pluralityof semiconductor material pillars in a spaced relationship on asemiconductor substrate. A surrounding gate electrode is formed on anouter surface of ones of the pillars. A first source/drain region isformed in the semiconductor substrate between adjacent ones of thepillars. A bit line is formed in the first source/drain region andelectrically coupled to the first source/drain region and a secondsource/drain region is formed in an upper portion of the ones of thepillars.

In further embodiments of the present invention, forming a plurality ofsemiconductor material pillars includes forming a pad oxide film and ahard mask pattern on the semiconductor substrate, forming a plurality ofpillars to a smaller width than the width of the hard mask pattern byetching the pad oxide film and the semiconductor substrate conformallyto the hard mask pattern and isolating the pillars by etching thesemiconductor substrate between the pillars to a predetermined depth.Forming a bit line may include forming the bit line to surround outersurfaces of the pillars. The methods may further include forming a wordline in a cross-wise pattern with the bit line so that the word line iselectrically connected to the gate electrode and removing the hard maskpattern. Forming a second source/drain region may include forming thesecond source/drain region in the upper portion of the ones of thepillars after removing the hard mask pattern to expose the upperportion.

In yet further embodiments of the present invention, forming a pluralityof pillars includes etching the pad oxide film and the semiconductorsubstrate to a predetermined depth using the hard mask pattern andetching sidewalls of the semiconductor substrate to a predeterminedwidth. Isolating the pillars by etching the semiconductor substrate to apredetermined depth may include anisotropically etching thesemiconductor substrate to a depth of about 800 Å to about 1,000 Å.Etching sidewalls of the semiconductor substrate may includeanisotropically etching the sidewalls to a width of about 200 Å to about300 Å using the hard mask pattern as an etching mask. The sidewalls ofthe semiconductor substrate may be anisotropically etched by plasma wetetching and/or chemical dry etching.

In other embodiments of the present invention, forming the surroundinggate electrode includes forming a gate oxide film on the pillars andsurfaces of the semiconductor substrate between the pillars, depositinga conductive film on the gate oxide film and etching back the conductivefilm so that the conductive film remains on sidewalls of the pillars.Forming the first source/drain region may include ionically implantingan impurity in an exposed portion of the semiconductor substrate betweenthe pillars by the hard mask pattern and the surrounding gate electrode.

In further embodiments of the present invention, forming the bit line inthe drain region includes forming a groove in the drain region to ashallower depth than the drain region, forming a dielectric film atsidewalls of the groove, selectively forming a conductive line in thegroove and etching a predetermined portion of the conductive line toform the bit line. Forming the groove may include coating a dielectricfilm on a surface of the semiconductor substrate, etching back thedielectric film so that the dielectric film surrounds an outer surfaceof the surrounding gate electrode and a predetermined portion of thedrain region is exposed and etching the exposed portion of the drainregion to a predetermined depth using the etched-back dielectric film asan etching mask.

In yet other embodiments of the present invention, forming theconductive line includes depositing a transition metal film on a surfaceof the semiconductor substrate including the groove, selectively forminga transition metal silicide film by heating so that the transition metalfilm reacts with underlying semiconductor substrate material andremoving an unreacted portion of the transition metal film. Etching apredetermined portion of the conductive line to form the bit line mayinclude depositing a dielectric film on the semiconductor substratewhere the conductive line is formed, forming a dielectric spacer byetching back the dielectric film and etching the conductive line usingthe dielectric spacer as an etching mask. The dielectric film may beformed to a thickness selected to provide a filled space betweenadjacent ones of the pillars and/or a space between the pillars asviewed in the x-axis direction.

In further embodiments of the present invention, isolating the pillarsincludes etching the semiconductor substrate between the pillars to adepth of about 1,000 Å to about 1,500 Å using the bit line as an etchingmask. After isolating the pillars and before forming the word line, aconductive spacer may be formed on an upper outside of the surroundinggate electrode to provide conductivity of the surrounding gateelectrode. Forming the conductive spacer may include forming on thesemiconductor substrate a dielectric film to a substantially same heightas the hard mask pattern, removing the dielectric film to apredetermined depth so that sidewalls of the hard mask pattern and upperoutsides of the surrounding gate electrode are exposed, depositing aconductive film on the semiconductor substrate including the dielectricfilm removed to a predetermined depth and etching back the conductivefilm to form the conductive spacer on the exposed sidewalls of the hardmask pattern and the exposed upper outsides of the surrounding gateelectrode. Removing the dielectric film may include removing thedielectric film by a wet etch-back process. The conductive film for theconductive spacer may be a transition metal film formed of tungsten (W),cobalt (Co), nickel (Ni), and/or titanium (Ti); a transition metalsilicide film formed of tungsten silicide (WSi_(x)), cobalt suicide(CoSi_(x)), nickel suicide (NiSi_(x)), and/or titanium suicide(TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W). Theconductive spacer may be formed to a lower height than the hard maskpattern.

In other embodiments of the present invention, forming the word lineincludes forming on the semiconductor substrate including the conductivespacer, a first dielectric film to a substantially same height as thehard mask pattern, forming a second dielectric film on the firstdielectric film, forming a photoresist pattern on the second dielectricfilm in a cross-wise pattern with the bit line so that the hard maskpattern is exposed, etching the first and second dielectric films to apredetermined depth using the photoresist pattern as an etching mask,removing the photoresist pattern, depositing a conductive film on thesemiconductor substrate including the etched first and second dielectricfilms with the photoresist pattern removed and etching back theconductive film to a lower height than the hard mask pattern to form theword line. The first and second dielectric films may be formed of amaterial having etching selectivity with respect to the hard maskpattern. Etching the first and second dielectric films may includeetching the first and second dielectric films to a depth that exposes aportion of the conductive spacer.

In yet further embodiments of the present invention, the conductive filmfor the word line includes a transition metal film formed of tungsten(W), cobalt (Co), nickel (Ni), and/or titanium (Ti); a transition metalsilicide film formed of tungsten silicide (WSi_(x)), cobalt silicide(CoSi_(x)), nickel silicide (NiSi_(x)), and/or titanium silicide(TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W).Etching back the conductive film to form the word line may includeinitially etching back the conductive film so that the hard mask patternis exposed and further etching back the conductive film to a lowerheight than the hard mask pattern. Forming the second source/drainregion may include implanting ionic impurities in the pillars on whichthe hard mask pattern is removed.

In other embodiments of the present invention, after forming the secondsource/drain region, the methods further include forming a contact padon the second source/drain region and electrically connected thereto andforming a storage node electrode on the contact pad and electricallyconnected thereto. The contact pad may be electrically insulated fromthe conductive spacer and the gate electrode.

In further embodiments of the present invention, methods ofmanufacturing a semiconductor memory device include forming on asemiconductor substrate a hard mask pattern defining a pad oxide filmand an active region, forming a plurality of pillars by etching the padoxide film to a predetermined depth and the semiconductor substrate to apredetermined width using the hard mask pattern as an etching mask,forming a surrounding gate electrode on an outer surface of ones of thepillars, forming a drain region in the semiconductor substrate betweenthe ones of the pillars, selectively forming a conductive line in thedrain region, forming a dielectric spacer surrounding the hard maskpattern, forming a bit line by etching the conductive line using thedielectric spacer as an etching mask, isolating the ones of the pillarsby etching the semiconductor substrate using the bit line as an etchingmask, forming a conductive spacer on an upper outside of the surroundinggate electrode, forming a word line contacting with the conductivespacer in a cross-wise pattern with the bit line, removing the hard maskpattern, forming a source region in the pillars where the hard maskpattern is removed, forming a contact pad on the source region so thatthe contact pad contacts with the source region and is electricallyinsulated from the conductive spacer and the gate electrode and forminga storage node electrode on the contact pad. Forming the source regionmay include depositing a dielectric film on the semiconductor substratein a region where the hard mask pattern is removed, forming a dielectricspacer at sidewalls of the conductive spacer by anisotropically etchingthe dielectric film to expose the pad oxide film, etching the pad oxidefilm using the dielectric spacer as an etching mask and implanting animpurity in exposed portions of the ones of the pillars

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A through 1H are perspective views illustrating a semiconductor(integrated circuit) memory device according to some embodiments of thepresent invention;

FIGS. 2A through 2D are plan views illustrating a semiconductor memorydevice according to some embodiments of the present invention;

FIGS. 3A through 3O are cross-sectional views taken along lines a-a′ ofFIGS. 2A through 2D;

FIGS. 4A through 4M are cross-sectional views taken along lines b-b′ ofFIGS. 2A through 2D; and

FIGS. 5A through 5P are cross-sectional views taken along lines c-c′ ofFIGS. 2A through 2D.

DETAILED DESCRIPTION OF THE INVENTION

The invention is described more fully hereinafter with reference to theaccompanying drawings, in which embodiments of the invention are shown.This invention may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein.Rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art. In the drawings, the size and relativesizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly oil, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Embodiments of the present invention are described herein with referenceto cross-section illustrations that are schematic illustrations ofidealized embodiments of the present invention. As such, variations fromthe shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,embodiments of the present invention should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, an etched region illustrated as a rectanglewill, typically, have rounded or curved features. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region of a device andare not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

As will be described herein, some embodiments of the present inventionmay provide a semiconductor memory device that can be ultra-highlyintegrated. Other embodiments may provide a simple manufacturing methodof a semiconductor memory device that can be ultra-highly integrated.

Various embodiments of the present invention for forming a semiconductordevice will now be further described with reference to the figures.Referring first to FIGS. 1A, 2A, 3A, 4A, and 5A, a pad oxide film 105 isformed on a semiconductor (integrated circuit) substrate 100. The padoxide film 105 may be, for example, a silicon oxide film and may beformed to a thickness of about 50 to 150 Å by thermal oxidation. A hardmask film is deposited on the pad oxide film 105. The hard mask film maybe formed of a material having etching selectivity with respect to thepad oxide film 105 and the semiconductor substrate 100, for example,silicon nitride. To define an active region on the hard mask film, aphotoresist pattern (not shown) may be formed on the hard mask film by aconventional method. Hard mask patterns 110 may then be formed byetching the hard mask film Using the photoresist pattern as an etchingmask.

The length of one side of each hard mask pattern 110 is 1 F (where “F”is a minimum feature size of the semiconductor device). Spacing betweenadjacent ones of the hard mask patterns 110 in the x-axis direction is0.5 F and spacing between adjacent ones of the hard mask patterns 110 inthe y-axis direction is 1.5 F.

Next, the pad oxide film 105 and the semiconductor substrate 100 areshown as etched to a predetermined depth using the hard mask patterns110 as etching masks. The semiconductor substrate 100, in someembodiments, is etched to a depth of about 800 to 1,500 Å. Asparticularly shown in FIG. 4A, a region represented by a dotted lineillustrates a surface of the semiconductor substrate 100 before theetching. Through the etching of the semiconductor substrate 100, pillars100 a are formed as active regions in the semiconductor substrate 100.The hard mask patterns 110 may initially be square-shaped as shown inthe plan view of FIG. 2A but may subsequently obtain a substantiallycylindrical structure as shown in FIG. 1A as the etching processproceeds.

Referring now to the embodiments of FIGS. 1B, 3B, 4A, and 5B, thesemiconductor substrate 100, in particular, sidewalls of the pillars 100a of the semiconductor substrate 100 are, for example, anisotropicallyetched to a predetermined width A using the hard mask patterns 110 asetching masks. For example, the pillars 100 a may be etched by plasmawet etching and/or chemical dry etching. A distance A between a sidewallof each of the pillars 100 a and the same side sidewall of correspondingone of the hard mask patterns 110 may correspond to a thickness intendedfor a gate electrode, for example 200 to 300 Å.

Referring next to FIGS. 3C, 4B, and 5C, a first dielectric film 115 isformed on exposed portions of the semiconductor substrate 100, inparticular, on surfaces of the pillars 100 a and surfaces of thesemiconductor substrate 100 between the pillars 100 a. The firstdielectric film 115 may be, for example, a gate dielectric film formedof silicon oxide (SiO₂), hafnium oxide (HfO₂), tantalum oxide (Ta₂O₅),and/or ONO (oxide/nitride/oxide). The first dielectric film 115 may beformed by oxidation of the semiconductor substrate 100 and/ordeposition.

A first conductive film 120 is shown deposited on the resultantsemiconductor substrate structure. The first conductive film 120 may beformed of a gate electrode material. The first conductive film 120 maybe, for example, a polysilicon film doped with an n- or p-type impurityand/or a silicon germanium film.

Referring now to FIGS. 1C, 3D, 4C, and 5D, the first conductive film 120is shown etched back using the first dielectric film 115, i.e., the gatedielectric film, as an etch stop film, thereby resulting in formation ofsurrounding gate electrodes 120 a surrounding the pillars 100 a. In someembodiments, the surrounding gate electrodes 120 a are formed in spacesdefined between the pillars 100 a and the hard mask patterns 110 andhave a vertical sectional shape with respect to the surface of thesemiconductor substrate 100.

As seen in the embodiments of FIGS. 3E, 4D, and 5E, lower drain (and/orsource) regions 125 are formed in the semiconductor substrate 100between the pillars 100 a by, for example, ion implantation of animpurity 122, such as phosphorus (P) and/or arsenic (As).

Referring now to the embodiments of FIGS. 3F, 4E, and 5F, a seconddielectric film 130 is deposited to a thickness, for example, of 100 to200 Å, on the resultant semiconductor substrate structure. The seconddielectric film 130 may be a film having etching selectivity withrespect to the semiconductor substrate 100, for example, a siliconnitride film. The second dielectric film 130 is etched back so that itremains on surfaces of the surrounding gate electrodes 120 a. As aresult, the surrounding gate electrodes 120 a may be isolated by the padoxide film 105, the first dielectric film 115 (gate dielectric film),and the second dielectric film 130. Subsequently, an exposed portion ofthe first dielectric film 115 (gate dielectric film) on the drainregions 125 may be removed, for example, using the second dielectricfilm 130 as an etching mask.

As shown in the embodiments of FIGS. 3G, 4F, and 5G, exposed portions ofthe lower drain regions 125 are, for example, anisotropically etched toa predetermined depth using the second dielectric film 130 remaining onthe surfaces (sidewall surfaces) of the surrounding gate electrodes 120a as etching masks to form grooves 135. At this time, the grooves 135 insome embodiments have a shallower depth than the lower drain regions125. The grooves 135 may be regions intended to be occupied by bitlines. A third dielectric film 140 is shown formed on exposed surfacesof the semiconductor substrate 100, in other words, on surfaces of thegrooves 135. The third dielectric film 140 may be a silicon oxide filmand/or a silicon nitride film and may be formed to a thickness of about50 to 100 Å. In some embodiments, the third dielectric film 140 isformed on surfaces of the grooves 135 by surface oxidation of thegrooves 135.

The third dielectric film 140 is etched back so that it remains only onsidewalls of the grooves 135. At this time, the third dielectric film140 disposed on the sidewalls of the grooves 135 may serve toelectrically insulate the surrounding gate electrodes 120 a and bitlines to be formed in the grooves 135.

Referring now to FIGS. 3H, 4G, and 5H, suicide films 145 are formed onexposed portions of the semiconductor substrate 100. For example, thesuicide films 145 may be formed by depositing a second conductive filmon the semiconductor substrate structure and then thermally treating theresultant semiconductor structure to cause a reaction between the secondconductive film and a silicon material of the semiconductor substrate100. The second conductive film may be a film formed of a transitionmetal, such as cobalt (Co), titanium (Ti), nickel (Ni), and/or tungsten(W) and may have a thickness of 100 to 300 Å. As a result, the silicidefilms 145 may be formed on exposed portions of the semiconductorsubstrate 100 by direct contact reaction of the second conductive filmwith the semiconductor substrate 100. In other words, the suicide films145 may be selectively formed only on exposed portions of thesemiconductor substrate 100, in particular, only in the grooves 135 inthe drain regions 125.

During this processing, portions of the second conductive film formed ondielectric films may remain unreacted in the form of a transition metalfilm even when thermally treated. The second conductive film remainingunreacted may then be removed by a conventional method to result in theillustrated structure of FIGS. 3H, 4G, and 5H. As the silicide films 145are formed in the grooves 135 of the drain regions 125, they may beelectrically connected to the drain regions 125 but insulated from thesurrounding gate electrodes 120 a.

As illustrated in the embodiments of FIGS. 1D, 3I, 4G, and 5I, a fourthdielectric film 150 is deposited on the resultant semiconductorsubstrate structure on which the silicide films 145 are formed. Forexample, the fourth dielectric film 150 may be a silicon oxide filmand/or a silicon nitride film. In some embodiments, the fourthdielectric film 150 is formed to a thickness sufficient to fill spacesbetween the pillars 100 a arrayed along the line a-a′ (X-axis direction)of FIG. 2A, in other words, spaces between adjacent ones of the pillars100 a. The fourth dielectric film 150 may then be etched back. As aresult, the fourth dielectric film 150 may be formed as a spacersurrounding the hard mask patterns 110 and the surrounding gateelectrodes 120 a and may be absent in spaces between the pillars 100 ain the y-axis direction. Thus, as shown in FIGS. 1D, 31, 4G, and 5I, thefourth dielectric film 150 of a spacer form fills spaces between thepillars 100 a in the x-axis direction.

Next, referring to the embodiments of FIGS. 1E, 2B, 3J, 4H, and 5J,exposed portions of the silicide films 145 are etched using the fourthdielectric film 150 as an etching mask to define bit lines 145 a. Thebit lines 145 a are formed to surround the pillars 100 a as shown in theillustrated embodiments and extend along the x-axis direction as viewedin a plan view. The bit lines 145 a may be electrically insulated fromthe surrounding gate electrodes 120 a by the third dielectric film 140.For these illustrated embodiments, the bit lines 145 a may be formed ina self-aligned manner without requiring a separate mask pattern. Then,an exposed portion of the semiconductor substrate 100 is etched to apredetermined depth B (FIG. 1E, 4H), for example, 1,000 to 1,500 A,using the bit lines 145 a as etching masks, to form trenches 155 (FIG.4H). Adjacent ones of the pillars 100 a may be isolated by the trenches155. The pillars 100 a after being isolated are indicated by a referencenumeral 100 b in the figures.

Referring now to the embodiments of FIGS. 3J, 41, and 5K, a fifthdielectric film 160, for example, a silicon oxide film, is deposited onthe resultant semiconductor substrate structure so that the trenches 155are sufficiently filled. The fifth dielectric film 160 may be planarizedso that the hard mask patterns 110 are exposed. This planarization maybe performed by, for example, a chemical mechanical polishing processand/or an etch-back process. In some embodiments, the fifth dielectricfilm 160 is formed in when the fourth dielectric film 150 is formed.However, the fourth dielectric film 150 may also be removed prior to theformation of the fifth dielectric film 160 in other embodiments.

The fifth dielectric film 160 and the fourth dielectric film 150 aresubjected to, for example, a wet etch-back process, to a predetermineddepth. The fifth dielectric film 160 and the fourth dielectric film 150may be etched back to a lower height than the hard mask patterns 110(FIG. 5K). An exposed portion of the second dielectric film 130 coveringthe surrounding gate electrodes 120 a is removed. As a result, upperoutside surfaces of the surrounding gate electrodes 120 a may beexposed.

Next, third conductive spacers 165 are formed. The third conductivespacers 165 may be formed by depositing a third conductive film on theresultant semiconductor substrate structure. The third conductive filmmay be a transition metal film formed of tungsten (W), cobalt (Co),nickel (Ni), and/or titanium (Ti); a transition metal silicide filmformed of tungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)),nickel silicide (NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/ora tungsten nitride film (WN)/tungsten film (W). Then, the thirdconductive film may be etched back so that surfaces of the hard maskpatterns 110 are exposed, to thereby form the conductive spacers 165.The conductive spacers 165 contact with upper outside surfaces of thesurrounding gate electrodes 120 a to enhance conductivity of thesurrounding gate electrodes 120 a, which may be formed of polysilicon.At this time, the conductive spacers 165 in some embodiments areexcessively etched back to a lower height than the hard mask patterns110.

Referring next to the embodiments of FIGS. 2C, 3K, 4J, and 5L, a sixthdielectric film 170 is deposited on the resultant semiconductorsubstrate structure on which the conductive spacers 165 are formed, sothat spaces between the hard mask patterns 110 are sufficiently filled.The sixth dielectric film 170 may be a silicon oxide film, like thefifth dielectric film 160. The sixth dielectric film 170 may beplanarized so that surfaces of the hard mask patterns 110 are exposed.The planarization may be performed, for example, by a chemicalmechanical polishing process and/or an etch-back process.

A seventh dielectric film 175 is deposited to a thickness of about 200to 1,000 Å on the planarized sixth dielectric film 170. The seventhdielectric film 175 may also be a silicon oxide film. Then, aphotoresist pattern 180 is formed on the seventh dielectric film 175 sothat the hard mask patterns 110 and the seventh dielectric film 175between the hard mask patterns 110 a in the y-axis direction (FIG. 2C)are exposed. That is, the photoresist pattern 180 and alternatingregions left exposed by the photoresist pattern 180 run in parallel tothe y-axis direction. Exposed portions of the seventh and sixthdielectric films 175 and 170 are etched to a predetermined thickness,for example a thickness of 1,000 to 2,000 Å using the photoresistpattern 180 as an etching mask. As a result, predetermined portions ofthe hard mask patterns 110 and the conductive spacers 165 are exposed.

Referring now to the embodiments of FIGS. 1F, 2D, 3L, 4K, and 5M, thephotoresist pattern 180 may be removed by a conventional method. Then,word lines 185 (FIG. 5M) are formed. To form the word lines 185, afourth conductive film for word lines may be deposited to a thickness ofabout 1,000 to 2,000 Å on the resultant semiconductor substratestructure so that spaces between the seventh and sixth dielectric films175 and 170 are sufficiently filled. The fourth conductive film may alsobe a transition metal film formed of tungsten (W), cobalt (Co), nickel(Ni), and/or titanium (Ti); a transition metal suicide film formed oftungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide(NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/or a tungstennitride film (WN)/tungsten film (W), like the third conductive film.Then, for node isolation of the fourth conductive film, the fourthconductive film and the seventh dielectric film 175 may be etched backso that the hard mask patterns 110 are exposed. Then, the fourthconductive film may be further etched back to a lower height than thesixth dielectric film 170 and the hard mask patterns 110, to therebyform word lines 185.

The word lines 185 in the illustrated embodiments extend along they-axis as shown in FIG. 2D and are substantially orthogonal to the bitlines 145 a extending along the x-axis. The word lines 185 may beelectrically connected to the surrounding gate electrodes 120 a via theconductive spacers 165.

Referring now to the embodiments of FIGS. 3M, 4L, and 5N, an eighthdielectric film 190 is deposited, for example, to a thickness of about1,000 to 2,000 Å on the resultant semiconductor substrate structure onwhich the word lines 185 are formed. The eight dielectric film 190 maybe a silicon oxide film, like the fifth through seventh dielectric films160, 170, and 175. The eighth dielectric film 190 may be planarized sothat the hard mask patterns 110 are exposed. At this time, as theheights of the word lines 185 are lower than those of the hard maskpatterns 110, the word lines 185 are isolated by the fifth throughseventh dielectric films 160, 170, and 175 even when the eighthdielectric film 190 is planarized. Then, the hard mask patterns 110 maybe removed by a conventional method. As a result, the pad oxide film 105on the pillars 100 b may be exposed.

Next, referring to the embodiments of FIGS. 1G, 3N, 4M, and 5O,dielecric spacers 195 are formed. The dielectric spacers 195 may beformed by depositing a ninth dielectric film, having etching selectivitywith respect to the semiconductor substrate 100 and the pad oxide film105, on the resultant semiconductor substrate structure. For example,the ninth dielectric film may be a silicon nitride film and may beformed to a thickness of about 100 to 300 Å. The ninth dielectric filmmay be etched back so that a surface of the resultant semiconductorsubstrate structure, including a surface of the sixth dielectric film170, is exposed to form the dielectric spacers 195 surrounding exposedsidewalls of the conductive spacers 165. The dielectric spacers 195 mayserve to electrically insulate the conductive spacers 165 andsubsequently formed contact pads.

An exposed portion of the pad oxide film 105 is etched using thedielectric spacers 195 as etching masks to expose surfaces of thepillars 10 b. Impurities, for example, phosphorus (P) and/or arsenic(As), may be ionically implanted into the exposed surfaces of thepillars 100 b to form source (and/or drain) regions 200. As a result,vertical channel MOS transistors are formed including the gateelectrodes 120 a formed on sidewalls of the pillars 100 b, the sourceregions 200 formed in upper portions of the pillars 100 b, and the drainregions 125 formed between the pillars 10 b. In these vertical channelMOS transistors, the source regions 200 and the drain regions 125 arerespectively disposed in upper and lower sides, and the gate electrodes120 a are disposed perpendicularly to a surface of the semiconductorsubstrate 100, thereby forming vertical channels with respect to asurface of the semiconductor substrate 100. Therefore, in someembodiments of the present invention, the vertical channel MOStransistors can have a sufficient channel length and occupy much smallerareas of the semiconductor substrate 100, relative to planar MOStransistors.

Storage node contact pads 205 may then be formed. A fifth conductivefilm may be deposited so that spaces between the dielectric spacers 195are sufficiently filled. The fifth conductive film may be a polysiliconfilm containing an n-type impurity and may be formed to a thickness ofabout 500 to 1,500 Å. The fifth conductive film may be planarized sothat surfaces of the dielectric spacers 195 are exposed, thereby formingthe storage node contact pads 205 contacting with the source regions200. As the storage node contact pads 205 for such embodiments may beformed in a self-aligned manner in the spaces for the hard mask patterns110, unlike DRAM devices with conventional planar MOS transistors, noseparate mask patterns for defining the storage node contact pads 205are required in some embodiments of the present invention.

Referring now to the embodiments of FIGS. 1H, 3O, 4M, and 5P, an etchstopper 210 is deposited on exposed portions of the storage node contactpads 205, the sixth dielectric film 170, and the eighth dielectric film190. For example, the etch stopper 210 may be a silicon nitride film anddeposited to a thickness of 100 to 500 Å. A mold oxide film may bedeposited to a thickness of about 10,000 to 30,000 Å on the etch stopper210. The mold oxide film and the etch stopper 210 may be etched so thatthe storage node contact pads 205 are exposed, to thereby define storageregions (not shown).

Storage node electrodes 215 may be formed. In particular, a sixthconductive film may be deposited on the mold oxide film and the storageregions. For example, the sixth conductive film may be a polysiliconfilm doped with an n-type impurity and/or a metal film such as atitanium film, a nickel film, a titanium nitride film, and/or aruthenium film. The sixth conductive film may be formed to a thicknessof about 100 to 500 Å. A sacrificing film may be formed on the sixthconductive film and then the sacrificing film and the sixth conductivefilm may be chemically and/or mechanically polished so that a surface ofthe mold oxide film is exposed, to thereby form the storage nodeelectrodes 215. The mold oxide film and the sacrificing film may then beremoved as illustrated in the figures.

In semiconductor memory devices with the above-described verticalchannel MOS transistors, as shown in FIGS. 1H and 2D, the gateelectrodes 120 a may be formed on outer surfaces of the pillars 100 b,and the source regions 200 and the drain regions 125 may be,respectively, formed on upper and lower sides with respect to the gateelectrodes 120 a. As such, an area (C) occupying one MOS transistor maybe 3.75 F² (2.5 F×1.5 F), provided that the linewidth of each hard maskpattern 110 is F. Therefore, an area of a MOS transistor according tosome embodiments of the present invention can be reduced to less than ½of the area (8F²) of a typical conventional planar MOS transistor.

In vertical channel MOS transistors according to some embodiments of thepresent invention, channels are formed perpendicularly to a substratesurface. Therefore, a channel length can be increased for a givensubstrate area, which may reduce or even prevent a short channel effect.

Furthermore, in vertical channel MOS transistors according to someembodiments of the present invention, as the gate electrodes 120 a areformed on outer surfaces of the pillars 100 b, i.e., on outer surfacesof pillar-shaped active regions, a channel width may be more than π-foldlarger than that of MOS transistors with line-shaped gate electrodes. Asa result, on-current (operating current) of the vertical channel MOStransistors can be enhanced. Also, in vertical channel MOS transistorsaccording to some embodiments of the present invention, the gateelectrodes 120 a, the bit lines 145, the source and drain regions 200and 125, and the storage node contact pads 205 can be formed in aself-aligned manner by formation of the hard mask patterns 110.Therefore, there may be no need to perform repeatedly a photolithographyprocess, which may simplify a manufacturing process for the devices.

As apparent from the above description, according to some embodiments ofthe present invention, vertical channel MOS transistors are manufacturedin a self-aligned manner using hard mask patterns and pillars defined bythe hard mask patterns. Channels of the MOS transistors may be formed ina substrate vertically with respect to a surface of the substrate.Therefore, a channel length can be increased regardless of a transistorarea, which may reduce or prevent a short channel effect of thetransistor.

Furthermore, as gate electrodes in some embodiments are formed on outersurfaces of the pillars, channel widths can be increased relative tothose of conventional planar gate electrodes, which may enhance theon-current of MOS transistors.

In semiconductor memory devices according to some embodiments of thepresent invention, as storage node electrodes are formed on a surface ofa semiconductor substrate, there may be no limitation on the height andsurface area of the storage node electrodes. In vertical channel MOStransistors of some embodiments of the present invention, gateelectrodes, bit lines, source and drain regions, and storage nodecontact pads can be formed in a self-aligned manner by hard maskpatterns without masking. Therefore, the number of photolithographyprocesses can be reduced relative to planar MOS transistors requiringnumerous mask patterns, thereby potentially simplifying a manufacturingprocess.

The foregoing is illustrative of the present invention and is not to beconstrued as limiting thereof. Although a few exemplary embodiments ofthis invention have been described, those skilled in the art willreadily appreciate that many modifications are possible in the exemplaryembodiments without materially departing from the novel teachings andadvantages of this invention. Accordingly, all such modifications areintended to be included within the scope of this invention as defined inthe claims. In the claims, means-plus-function clauses are intended tocover the structures described herein as performing the recited functionand not only structural equivalents but also equivalent structures.Therefore, it is to be understood that the foregoing is illustrative ofthe present invention and is not to be construed as limited to thespecific embodiments disclosed, and that modifications to the disclosedembodiments, as well as other embodiments, are intended to be includedwithin the scope of the appended claims. The invention is defined by thefollowing claims, with equivalents of the claims to be included therein

1. A semiconductor memory device comprising: a semiconductor substrate; a plurality of semiconductor material pillars in a spaced relationship on the semiconductor substrate; respective surrounding gate electrodes surrounding ones of the pillars; a first source/drain region in the semiconductor substrate between adjacent ones of the pillars; a second source/drain region in an upper portion of at least one of the adjacent pillars; a buried bit line in the first source/drain region and electrically coupled to the first source/drain region; and a storage node electrode on the upper portion of the at least one of the adjacent pillars and electrically contacting with the second source/drain region.
 2. The semiconductor memory device of claim 1, further comprising a word line contacting with ones of the surrounding gate electrodes and extending in a cross-wise pattern relative to the bit line.
 3. The semiconductor memory device of claim 2, further comprising respective conductive spacers between the word line and the ones of the surrounding gate electrodes contacting the word line.
 4. The semiconductor memory device of claim 3, wherein the conductive spacers are on an upper outside surface of the surrounding gate electrodes.
 5. The semiconductor memory device of claim 3, wherein a conductive film for the conductive spacers and the word line comprises a transition metal film of tungsten (W), cobalt (Co), nickel (Ni), and/or titanium (Ti); a transition metal silicide film of tungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W).
 6. The semiconductor memory device of claim 1, wherein the first and second source/drain regions are electrically insulated from the surrounding gate electrodes.
 7. The semiconductor memory device of claim 1, wherein a dielectric material is located between adjacent ones of the pillars to electrically insulate the adjacent ones of the pillars.
 8. The semiconductor memory device of claim 1, wherein the bit line is a transition metal silicide film.
 9. The semiconductor memory device of claim wherein: the plurality of pillars are formed in a matrix and are separated from each other by a predetermined distance; the first source/drain region is a drain region of a vertical channel transistor; and the second source/drain region is a source region of the vertical channel transistor.
 10. A semiconductor memory device comprising: a semiconductor substrate including a plurality of pillars separated from each other by a predetermined distance; a device isolation film between the pillars; respective surrounding gate electrodes electrically insulated from the pillars and surrounding an upper outside of each pillar; first source/drain regions formed in an upper portion of respective ones of the pillar; a second source/drain region formed in the semiconductor substrate between adjacent ones of the pillars; a buried bit line, interposed between the second source/drain region and the device isolation film, electrically contacting the second source/drain region; a word line formed in a cross-wise pattern with the bit line and electrically connected to ones of the surrounding gate electrodes; contact pads, formed on respective ones of the first source/drain regions and contacting the respective ones of the first source/drain regions; and storage node electrodes formed on the contact pads.
 11. The semiconductor memory device of claim 10, further comprising conductive spacers between an upper outside of the surrounding gate electrodes and the word line.
 12. The semiconductor memory device of claim 11, wherein a conductive film for the conductive spacers and the word line is a transition metal film formed of tungsten (W), cobalt (Co), nickel (Ni), and/or titanium (Ti); a transition metal silicide film formed of tungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W).
 13. The semiconductor memory device of claim 10, wherein the bit line surrounds a lower outside of respective ones of the pillars.
 14. The semiconductor memory device of claim 10, wherein the bit line is a transition metal silicide film.
 15. A method of manufacturing a semiconductor memory device, the method comprising: forming a plurality of semiconductor material pillars in a spaced relationship on a semiconductor substrate; forming respective surrounding gate electrodes on ones of the pillars; forming a first source/drain region in the semiconductor substrate between adjacent ones of the pillars; forming a bit line in the first source/drain region and electrically coupled to the first source/drain region; and forming a second source/drain region in an upper portion of at least one of the adjacent ones of the pillars.
 16. The method of claim 15 wherein forming a plurality of semiconductor material pillars includes: forming a pad oxide film and a hard mask pattern on the semiconductor substrate; forming a plurality of pillars to a smaller width than the width of the hard mask pattern by etching the pad oxide film and the semiconductor substrate conformally to the hard mask pattern; and isolating the pillars by etching the semiconductor substrate between the pillars to a predetermined depth; and wherein forming a bit line includes forming the bit line to surround outer surfaces of ones of the pillars; and wherein the method further comprises: forming a word line in a cross-wise pattern with the bit line so that the word line is electrically connected to ones of the surrounding gate electrodes; removing the hard mask pattern; and wherein forming a second source/drain region comprises forming the second source/drain region after removing the hard mask pattern to expose the upper portion.
 17. The method of claim 16, wherein forming a plurality of pillars includes: etching the pad oxide film and the semiconductor substrate to a predetermined depth using the hard mask pattern; and etching sidewalls of the semiconductor substrate to a predetermined width.
 18. The method of claim 17, wherein isolating the pillars by etching the semiconductor substrate to a predetermined depth includes anisotropically etching the semiconductor substrate to a depth of about 800 Å to about 1,500 Å.
 19. The method of claim 17, wherein etching sidewalls of the semiconductor substrate includes anisotropically etching the sidewalls to a width of about 200 Å to about 300 Å using the hard mask pattern as an etching mask.
 20. The method of claim 19, wherein the sidewalls of the semiconductor substrate are anisotropically etched by plasma wet etching and/or chemical dry etching.
 21. The method of claim 16, wherein forming the surrounding gate electrodes includes: forming a gate oxide film on the pillars and surfaces of the semiconductor substrate between the pillars; depositing a conductive film on the gate oxide film; and etching back the conductive film so that the conductive film remains on sidewalls of the pillars.
 22. The method of claim 16, wherein forming the first source/drain region includes implanting an ionic impurity in an exposed portion of the semiconductor substrate between the pillars by the hard mask pattern and the surrounding gate electrodes.
 23. The method of claim 16, wherein forming the bit line in the first source/drain region includes: forming a groove in the first source/drain region to a shallower depth than the drain region; forming a dielectric film at sidewalls of the groove; selectively forming a conductive line in the groove; and etching a predetermined portion of the conductive line to form the bit line.
 24. The method of claim 23, wherein forming the groove includes: coating a dielectric film on a surface of the semiconductor substrate; etching back the dielectric film so that the dielectric film surrounds an outer surface of the surrounding gate electrodes and a predetermined portion of the first source/drain region is exposed; and etching the exposed portion of the first source/drain region to a predetermined depth using the etched-back dielectric film as an etching mask.
 25. The method of claim 23, wherein forming the conductive line includes: depositing a transition metal film on a surface of the semiconductor substrate including the groove; selectively forming a transition metal silicide film by heating so that the transition metal film reacts with underlying semiconductor substrate material; and removing an unreacted portion of the transition metal film.
 26. The method of claim 23, wherein etching a predetermined portion of the conductive line to form the bit line includes: depositing a dielectric film on the semiconductor substrate where the conductive line is formed; forming a dielectric spacer by etching back the dielectric film; and etching the conductive line using the dielectric spacer as an etching mask, and wherein the dielectric film is formed to a thickness selected to provide a filled space between adjacent ones of the pillars and/or a space between the pillars as viewed in the x-axis direction.
 27. The method of claim 16, wherein isolating the pillars includes etching the semiconductor substrate between the pillars to a depth of about 1,000 Å to about 1,000 Å using the bit line as an etching mask.
 28. The method of claim 16, further comprising, after isolating the pillars and before forming the word line, forming respective conductive spacers on an upper outside of ones of the surrounding gate electrodes to provide conductivity of the ones of the surrounding gate electrodes.
 29. The method of claim 28, wherein forming the conductive spacers includes: forming on the semiconductor substrate a dielectric film to a substantially same height as the hard mask pattern; removing the dielectric film to a predetermined depth so that sidewalls of the hard mask pattern and upper outsides of the surrounding gate electrodes are exposed; depositing a conductive film on the semiconductor substrate including the dielectric film removed to a predetermined depth; and etching back the conductive film to form the conductive spacers on the exposed sidewalls of the hard mask pattern and the exposed upper outsides of the surrounding gate electrodes.
 30. The method of claim 29, wherein removing the dielectric film includes removing the dielectric film by a wet etch-back process.
 31. The method of claim 29, wherein the conductive film for the conductive spacers comprises a transition metal film formed of tungsten (W), cobalt (Co), nickel (Ni), and/or titanium (Ti); a transition metal silicide film formed of tungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W).
 32. The method of claim 29, wherein the conductive spacers are formed to a lower height than the hard mask pattern.
 33. The method of claim 16, wherein forming the word line includes: forming, on the semiconductor substrate including the conductive spacer, a first dielectric film to a substantially same height as the hard mask pattern; forming a second dielectric film on the first dielectric film; forming a photoresist pattern on the second dielectric film in a cross-wise pattern with the bit line so that the hard mask pattern is exposed; etching the first and second dielectric films to a predetermined depth using the photoresist pattern as an etching mask; removing the photoresist pattern; depositing a conductive film on the semiconductor substrate including the etched first and second dielectric films with the photoresist pattern removed; and etching back the conductive film to a lower height than the hard mask pattern to form the word line.
 34. The method of claim 33, wherein the first and second dielectric films are formed of a material having etching selectivity with respect to the hard mask pattern.
 35. The method of claim 33, wherein etching the first and second dielectric films includes etching the first and second dielectric films to a depth that exposes a portion of the conductive spacers.
 36. The method of claim 33, wherein the conductive film for the word line comprises a transition metal film formed of tungsten (W), cobalt (Co), nickel (Ni), ande/or titanium (Ti); a transition metal silicide film formed of tungsten silicide (WSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)), and/or titanium silicide (TiSi_(x)); and/or a tungsten nitride film (WN)/tungsten film (W).
 37. The method of claim 33, wherein etching back the conductive film to form the word line includes: initially etching back the conductive film so that the hard mask pattern is exposed; and further etching back the conductive film to a lower height than the hard mask pattern.
 38. The method of claim 16, wherein forming the second source/drain region includes implanting ionic impurities in the pillars on which the hard mask pattern is removed.
 39. The method of claim 16, further comprising, after forming the second source/drain region: forming a contact pad on the second source/drain region and electrically connected thereto; and forming a storage node electrode on the contact pad and electrically connected thereto; and wherein the contact pad is electrically insulated from the conductive spacers and the gate electrodes.
 40. A method of manufacturing a semiconductor memory device, the method comprising: forming on a semiconductor substrate a hard mask pattern defining a pad oxide film and an active region; forming a plurality of pillars by etching the pad oxide film to a predetermined depth and the semiconductor substrate to a predetermined width using the hard mask pattern as an etching mask; forming a surrounding gate electrode on an outer surface of ones of the pillars; forming a drain region in the semiconductor substrate between the ones of the pillars; selectively forming a conductive line in the drain region; forming a dielectric spacer surrounding the hard mask pattern; forming a bit line by etching the conductive line using the dielectric spacer as an etching mask; isolating the ones of the pillars by etching the semiconductor substrate using the bit line as an etching mask; forming a conductive spacer on an upper outside of the surrounding gate electrode; forming a word line contacting the conductive spacer in a cross-wise pattern with the bit line; removing the hard mask pattern; forming a source region in the pillars where the hard mask pattern is removed; forming a contact pad on the source region so that the contact pad contacts the source region and is electrically insulated from the conductive spacer and the gate electrode; and forming a storage node electrode on the contact pad.
 41. The method of claim 40, wherein forming the source region comprises: depositing a dielectric film on the semiconductor substrate in a region where the hard mask pattern is removed; forming a dielectric spacer at sidewalls of the conductive spacer by anisotropically etching the dielectric film to expose the pad oxide film; etching the pad oxide film using the dielectric spacer as an etching mask; and implanting an impurity in exposed portions of the ones of the pillars. 